Wafer Slicing Diamond Saw from China
Wafer slicing diamond saws cut thin wafers from monocrystalline semiconductor boules, classified under HTS 8412.90.90.85 as motor parts for semiconductor wafer manufacturing equipment. They ensure precise slicing for subsequent device fabrication processes.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify diamond blade specs and wafer thickness capabilities in import docs
• Obtain BIS export licenses if sourcing from controlled countries
• Test for vibration-free operation certification to meet cleanroom standards