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8412.90.90.85/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Wafer lapping machines use abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness, classified as HTS 8412.90.90.85 parts. They correct thickness variations from prior slicing and grinding steps.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Declare slurry compatibility and lapping pressure specs for accurate HTS

• Ensure cleanroom-compatible materials to avoid contamination issues at entry

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8412.90.90.85