Wafer Lapping Machine from Germany
Wafer lapping machines use abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness, classified as HTS 8412.90.90.85 parts. They correct thickness variations from prior slicing and grinding steps.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Declare slurry compatibility and lapping pressure specs for accurate HTS
• Ensure cleanroom-compatible materials to avoid contamination issues at entry