8412.90.90.85/Wafer Lapping Machine/Germany

Wafer Lapping Machine from Germany

Wafer lapping machines use abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness, classified as HTS 8412.90.90.85 parts. They correct thickness variations from prior slicing and grinding steps.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Declare slurry compatibility and lapping pressure specs for accurate HTS

• Ensure cleanroom-compatible materials to avoid contamination issues at entry