Wafer Lapping Machine from Canada
Wafer lapping machines use abrasive slurries to achieve ultra-flat surfaces on semiconductor wafers for fabrication readiness, classified as HTS 8412.90.90.85 parts. They correct thickness variations from prior slicing and grinding steps.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Declare slurry compatibility and lapping pressure specs for accurate HTS
• Ensure cleanroom-compatible materials to avoid contamination issues at entry