8412.90.90.85/Wafer Edge Profiling Grinder/Japan

Wafer Edge Profiling Grinder from Japan

Wafer edge profiling grinders shape wafer peripheries to prevent chipping during handling, classified HTS 8412.90.90.85 as semiconductor prep motor parts. Ensures safe wafer transport in fabs.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Highlight edge bead removal capability specific to wafers

• Import with safety data sheets for grinding byproducts

• Avoid general tool classification by specifying 300mm wafer compatibility