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8412.90.90.85/Wafer Edge Profiling Grinder/China

Wafer Edge Profiling Grinder from China

Wafer edge profiling grinders shape wafer peripheries to prevent chipping during handling, classified HTS 8412.90.90.85 as semiconductor prep motor parts. Ensures safe wafer transport in fabs.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Highlight edge bead removal capability specific to wafers

• Import with safety data sheets for grinding byproducts

• Avoid general tool classification by specifying 300mm wafer compatibility

Wafer Edge Profiling Grinder from China — Import Duty Rate | HTS 8412.90.90.85