Stress Relief Wafer Annealer Motor Assembly from Japan
Motor assemblies for wafer annealers relieve grinding-induced stresses through controlled heating, classified HTS 8412.90.90.85 as semiconductor processing parts. Improves wafer yield.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Prove integration with grinding equipment sequence
• Electrical safety certifications speed customs
• Avoid parts of furnaces classification by emphasizing motor function