8412.90.90.85/High-Speed Wafer Spindle Motor/Japan

High-Speed Wafer Spindle Motor from Japan

High RPM spindle motors powering wafer grinding heads to >10,000 RPM, under HTS 8412.90.90.85 for precision semiconductor surface preparation. Enables fine material removal.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document RPM ratings and balance certifications

• Vibration specs critical for classification support

• Consider spindle-motor assemblies vs separate parts