8412.90.90.85/High-Speed Wafer Spindle Motor/China

High-Speed Wafer Spindle Motor from China

High RPM spindle motors powering wafer grinding heads to >10,000 RPM, under HTS 8412.90.90.85 for precision semiconductor surface preparation. Enables fine material removal.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Document RPM ratings and balance certifications

• Vibration specs critical for classification support

• Consider spindle-motor assemblies vs separate parts