8412.90.90.85/Double-Sided Wafer Lapper/Japan

Double-Sided Wafer Lapper from Japan

Double-sided wafer lappers simultaneously process both wafer surfaces for superior flatness, under HTS 8412.90.90.85 as specialized lapping parts. Used for high-precision device wafers.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Declare carrier plate material and slurry flow rates

• Validate against statistical note wafer preparation examples

• Consider leasing vs buying for duty optimization