8412.90.90.85/Double-Sided Wafer Lapper/China

Double-Sided Wafer Lapper from China

Double-sided wafer lappers simultaneously process both wafer surfaces for superior flatness, under HTS 8412.90.90.85 as specialized lapping parts. Used for high-precision device wafers.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Declare carrier plate material and slurry flow rates

• Validate against statistical note wafer preparation examples

• Consider leasing vs buying for duty optimization