8412.90.90.25/Wafer Thickness Control Pneumatic Actuator/Japan

Wafer Thickness Control Pneumatic Actuator from Japan

Precision linear pneumatic actuator maintaining constant wafer thickness during simultaneous double-side grinding operations. Classified HTS 8412.90.9025 as part of linear acting pneumatic motors in semiconductor wafer grinders. Achieves ±0.5 micron thickness uniformity across 300mm wafers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document thickness uniformity specs and feedback loop integration; include vibration isolation design certification

• Common misclassification under general grinding machine parts