Wafer Thickness Control Pneumatic Actuator from Japan
Precision linear pneumatic actuator maintaining constant wafer thickness during simultaneous double-side grinding operations. Classified HTS 8412.90.9025 as part of linear acting pneumatic motors in semiconductor wafer grinders. Achieves ±0.5 micron thickness uniformity across 300mm wafers.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document thickness uniformity specs and feedback loop integration; include vibration isolation design certification
• Common misclassification under general grinding machine parts