Semiconductor Wafer Edge Grinder Pneumatic Drive from Japan
Linear acting pneumatic cylinder powering the edge grinding station that profiles semiconductor wafers for handling and prevents chipping during processing. HTS 8412.90.9025 as part of linear pneumatic motors in wafer preparation equipment. Ensures precise edge geometry for subsequent fabrication steps.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify edge profile tolerances (typically 0.001" for semiconductor wafers); provide cleanroom class 100 compatibility
• Distinguish from optical lens edge grinders through end-use documentation