Pneumatic Cylinder for Wafer Slicing Saw from Germany
This pneumatic linear acting cylinder drives the precise feed mechanism in wafer slicing saws used to cut monocrystalline semiconductor boules into thin wafers. It falls under HTS 8412.90.9025 as a part of linear acting pneumatic motors essential for semiconductor manufacturing equipment. The cylinder provides controlled linear motion critical for maintaining wafer thickness tolerances.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Verify the cylinder is specifically designed for linear acting pneumatic systems in semiconductor equipment; provide engineering specs showing wafer processing application
• Include manufacturer certification that it's not for general industrial use
• Watch for misclassification as semiconductor testing apparatus in Chapter 90