Pneumatic Cylinder for Wafer Slicing Saw from China
This pneumatic linear acting cylinder drives the precise feed mechanism in wafer slicing saws used to cut monocrystalline semiconductor boules into thin wafers. It falls under HTS 8412.90.9025 as a part of linear acting pneumatic motors essential for semiconductor manufacturing equipment. The cylinder provides controlled linear motion critical for maintaining wafer thickness tolerances.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Verify the cylinder is specifically designed for linear acting pneumatic systems in semiconductor equipment; provide engineering specs showing wafer processing application
• Include manufacturer certification that it's not for general industrial use
• Watch for misclassification as semiconductor testing apparatus in Chapter 90