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8412.90.90.05/Wafer Lapping Machine Hydraulic Cylinder/Japan

Wafer Lapping Machine Hydraulic Cylinder from Japan

Double-acting hydraulic cylinder for wafer lappers that achieve critical flatness tolerances before semiconductor fabrication. Classified HTS 8412.90.90.05 as linear acting hydraulic engine part used in wafer preparation equipment. Provides micron-level control essential for device yield.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Submit surface finish specifications (Ra values) proving semiconductor polishing requirements

• Include cleanroom compatibility certifications for import valuation

Wafer Lapping Machine Hydraulic Cylinder from Japan — Import Duty Rate | HTS 8412.90.90.05