Wafer Lapping Machine Hydraulic Cylinder from Japan
Double-acting hydraulic cylinder for wafer lappers that achieve critical flatness tolerances before semiconductor fabrication. Classified HTS 8412.90.90.05 as linear acting hydraulic engine part used in wafer preparation equipment. Provides micron-level control essential for device yield.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit surface finish specifications (Ra values) proving semiconductor polishing requirements
• Include cleanroom compatibility certifications for import valuation