Of linear acting engines and motors
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Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8412.90.90.05
Silicon Carbide Boule Hydraulic Grinder
High-strength hydraulic cylinder for grinding silicon carbide boules used in power semiconductor devices. HTS 8412.90.90.05 classification for linear acting parts in equipment processing ultra-hard semiconductor materials. Rated for extreme grinding pressures.
Semiconductor Wafer Slicing Hydraulic Ram
Heavy-duty hydraulic ram providing linear thrust for diamond wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8412.90.90.05 as a part of linear acting hydraulic power engines used in critical wafer preparation equipment. Ensures precise, vibration-free slicing essential for semiconductor device fabrication.
Float Zone Crystal Puller Hydraulic Rod
Hard chrome plated hydraulic rod for float zone crystal pullers producing ultra-pure monocrystalline silicon boules. HTS 8412.90.90.05 classification for linear acting hydraulic motor parts in semiconductor crystal growth equipment. Withstands high temperatures near melting zone.
Wafer Grinder Feed Hydraulic Piston
Servo-controlled hydraulic piston for automated infeed mechanisms on wafer grinders processing semiconductor slices to final thickness. HTS 8412.90.90.05 part of linear acting hydraulic power motors in wafer preparation equipment. Maintains 1 micron/minute removal rates.
Gallium Arsenide Wafer Polisher Actuator
Corrosion-resistant hydraulic actuator for polishers processing compound semiconductor wafers like gallium arsenide. Classified HTS 8412.90.90.05 as linear acting hydraulic engine part for specialized wafer preparation. Chemical-resistant seals for CMP slurries.
Monocrystalline Wafer Hydraulic Clamp Cylinder
Precision hydraulic clamp cylinder holding semiconductor wafers during lapping and polishing operations. Part of linear acting hydraulic motors under HTS 8412.90.90.05 for wafer preparation equipment. Vacuum-compatible for cleanroom use.
Hydraulic Cylinder Piston Assembly
Precision-machined piston designed for linear acting hydraulic cylinders used in semiconductor wafer grinders to achieve exact dimensional tolerances on crystal boules. This part falls under HTS 8412.90.90.05 as a component of linear acting hydraulic power engines and motors essential for semiconductor processing equipment. It enables controlled linear motion in high-precision grinding operations.
Crystal Boule Grinder Hydraulic Actuator
Hydraulic linear actuator for crystal grinders that shape semiconductor boules to precise diameters and flats indicating conductivity type. Falls under HTS 8412.90.90.05 as part of linear acting hydraulic motors in semiconductor crystal preparation equipment. Critical for maintaining resistivity specifications in wafer production.
Wafer Lapping Machine Hydraulic Cylinder
Double-acting hydraulic cylinder for wafer lappers that achieve critical flatness tolerances before semiconductor fabrication. Classified HTS 8412.90.90.05 as linear acting hydraulic engine part used in wafer preparation equipment. Provides micron-level control essential for device yield.
Czochralski Puller Hydraulic Base Cylinder
Large bore hydraulic base cylinder providing stable linear pull rates for Czochralski method silicon crystal growth from melt. Parts of linear acting hydraulic engines under HTS 8412.90.90.05 for semiconductor boule manufacturing. Controls growth rate at 1-2 mm/minute precision.