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8412.90.90.05/Wafer Lapping Machine Hydraulic Cylinder/China

Wafer Lapping Machine Hydraulic Cylinder from China

Double-acting hydraulic cylinder for wafer lappers that achieve critical flatness tolerances before semiconductor fabrication. Classified HTS 8412.90.90.05 as linear acting hydraulic engine part used in wafer preparation equipment. Provides micron-level control essential for device yield.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Submit surface finish specifications (Ra values) proving semiconductor polishing requirements

• Include cleanroom compatibility certifications for import valuation

Wafer Lapping Machine Hydraulic Cylinder from China — Import Duty Rate | HTS 8412.90.90.05