8412.90.90.05/Wafer Grinder Feed Hydraulic Piston/Japan

Wafer Grinder Feed Hydraulic Piston from Japan

Servo-controlled hydraulic piston for automated infeed mechanisms on wafer grinders processing semiconductor slices to final thickness. HTS 8412.90.90.05 part of linear acting hydraulic power motors in wafer preparation equipment. Maintains 1 micron/minute removal rates.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide servo valve integration specifications and feedback loop documentation

• Include wafer thickness tolerance data (typically ±0.5 micron)

• Common misclassification as CNC machine parts without semiconductor specs