Wafer Grinder Feed Hydraulic Piston from Germany
Servo-controlled hydraulic piston for automated infeed mechanisms on wafer grinders processing semiconductor slices to final thickness. HTS 8412.90.90.05 part of linear acting hydraulic power motors in wafer preparation equipment. Maintains 1 micron/minute removal rates.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide servo valve integration specifications and feedback loop documentation
• Include wafer thickness tolerance data (typically ±0.5 micron)
• Common misclassification as CNC machine parts without semiconductor specs