Wafer Grinder Feed Hydraulic Piston from China
Servo-controlled hydraulic piston for automated infeed mechanisms on wafer grinders processing semiconductor slices to final thickness. HTS 8412.90.90.05 part of linear acting hydraulic power motors in wafer preparation equipment. Maintains 1 micron/minute removal rates.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide servo valve integration specifications and feedback loop documentation
• Include wafer thickness tolerance data (typically ±0.5 micron)
• Common misclassification as CNC machine parts without semiconductor specs