Semiconductor Wafer Slicing Hydraulic Ram from China
Heavy-duty hydraulic ram providing linear thrust for diamond wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers. Classified under HTS 8412.90.90.05 as a part of linear acting hydraulic power engines used in critical wafer preparation equipment. Ensures precise, vibration-free slicing essential for semiconductor device fabrication.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide detailed drawings showing linear actuation mechanism and semiconductor end-use application
• Document compatibility with Czochralski crystal boule dimensions to prove wafer manufacturing purpose
• Avoid misclassification by distinguishing from general construction hydraulic rams through technical specs