8412.80.90.00/Wafer Lapping Machine Spindle Motor/Mexico

Wafer Lapping Machine Spindle Motor from Mexico

Spindle motors in wafer lapping machines rotate wafers against abrasive surfaces to achieve precise thickness uniformity for semiconductor fabrication. Falls under HTS 8412.80.90.00 as specialized motors for semiconductor wafer processing.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico

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Import Tips

• Specify total thickness variation (TTV) capabilities; provide lapping slurry compatibility info; distinguish from optical lens grinding motors