Other
Other engines and motors, and parts thereof: > Other engines and motors: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8412.80.90.00
Czochralski Crystal Puller
A Czochralski crystal puller is specialized equipment used to grow monocrystalline silicon boules from molten silicon, essential for semiconductor wafer production. It falls under HTS 8412.80.90.00 as 'other engines and motors' due to its mechanical drive systems and motors powering the pulling and rotation mechanisms in semiconductor manufacturing processes.
Float Zone Crystal Grower
Float zone crystal growers use zone melting to produce high-purity silicon ingots for semiconductor wafers without a crucible. Classified under HTS 8412.80.90.00 for its motor-driven zone traversal and rotation systems in semiconductor material processing.
Semiconductor Wafer Slicing Saw Motor Assembly
Precision motor assemblies power diamond wire or blade saws that slice semiconductor boules into thin wafers. Under HTS 8412.80.90.00 as other motors specifically for semiconductor wafer preparation equipment.
Crystal Boule Grinder Drive Motor
High-precision motors drive grinders that shape semiconductor crystal boules to exact diameters and flats indicating conductivity type. HTS 8412.80.90.00 covers these as other motors for semiconductor wafer preparation.
Wafer Lapping Machine Spindle Motor
Spindle motors in wafer lapping machines rotate wafers against abrasive surfaces to achieve precise thickness uniformity for semiconductor fabrication. Falls under HTS 8412.80.90.00 as specialized motors for semiconductor wafer processing.
Semiconductor Wafer Polishing Motor
Motors powering polishers that create atomically flat wafer surfaces for semiconductor device fabrication, critical for yield in chip manufacturing. HTS 8412.80.90.00 for these other motors in wafer preparation equipment.
Gallium Arsenide Crystal Growth Motor Assembly
Motor assemblies for growing GaAs compound semiconductor crystals using LEC or VGF methods for optoelectronic applications. Classified HTS 8412.80.90.00 as other motors for specialized semiconductor material production.
Silicon Ingot Puller Rotation Motor
Precision rotation motors maintaining uniform crystal growth in silicon ingot pullers by controlling boule rotation speed and stability. HTS 8412.80.90.00 for semiconductor-specific motor applications.
Wafer Grinder Spindle Drive Unit
Integrated drive units powering wafer backgrinding spindles to thin wafers to final device layer thickness in semiconductor packaging. Under HTS 8412.80.90.00 as other engines for wafer preparation.
Crystal Ingot Truing Motor
Motors for truing semiconductor ingots to perfect cylindrical shape before slicing, ensuring maximum wafer yield. HTS 8412.80.90.00 classification for semiconductor boule preparation motors.