8412.80.90.00/Wafer Lapping Machine Spindle Motor/Japan

Wafer Lapping Machine Spindle Motor from Japan

Spindle motors in wafer lapping machines rotate wafers against abrasive surfaces to achieve precise thickness uniformity for semiconductor fabrication. Falls under HTS 8412.80.90.00 as specialized motors for semiconductor wafer processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify total thickness variation (TTV) capabilities; provide lapping slurry compatibility info; distinguish from optical lens grinding motors