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8412.80.90.00/Wafer Grinder Spindle Drive Unit/Mexico

Wafer Grinder Spindle Drive Unit from Mexico

Integrated drive units powering wafer backgrinding spindles to thin wafers to final device layer thickness in semiconductor packaging. Under HTS 8412.80.90.00 as other engines for wafer preparation.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document target wafer thickness (50-100μm typical); specify TTV control; prepare for dual-use export licensing