8412.80.90.00/Wafer Grinder Spindle Drive Unit/Japan

Wafer Grinder Spindle Drive Unit from Japan

Integrated drive units powering wafer backgrinding spindles to thin wafers to final device layer thickness in semiconductor packaging. Under HTS 8412.80.90.00 as other engines for wafer preparation.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document target wafer thickness (50-100μm typical); specify TTV control; prepare for dual-use export licensing