Wafer Grinder Spindle Drive Unit from Japan
Integrated drive units powering wafer backgrinding spindles to thin wafers to final device layer thickness in semiconductor packaging. Under HTS 8412.80.90.00 as other engines for wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document target wafer thickness (50-100μm typical); specify TTV control; prepare for dual-use export licensing