Wafer Grinder Spindle Drive Unit from Germany
Integrated drive units powering wafer backgrinding spindles to thin wafers to final device layer thickness in semiconductor packaging. Under HTS 8412.80.90.00 as other engines for wafer preparation.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document target wafer thickness (50-100μm typical); specify TTV control; prepare for dual-use export licensing