8412.80.90.00/Semiconductor Wafer Polishing Motor/Japan

Semiconductor Wafer Polishing Motor from Japan

Motors powering polishers that create atomically flat wafer surfaces for semiconductor device fabrication, critical for yield in chip manufacturing. HTS 8412.80.90.00 for these other motors in wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include surface roughness (Ra) specs and CMP compatibility; prepare cleanroom certification docs; avoid classification with general metal polishing motors