Precision Wafer Edge Grinder from Mexico
Specialized grinder for profiling wafer edges to prevent chipping during handling and processing in semiconductor fabrication. Turbine-powered industrial machine >5,000 kW under HTS 8411.82.80.10 statistical note 1.
Duty Rate — Mexico → United States
12.5%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document edge profiling specifications (e.g
• chip angle, radius tolerance)
• Include handling capacity for 300mm wafers or larger
• Distinguish from general glass edge grinders in entry documentation