Precision Wafer Edge Grinder from Mexico
Specialized grinder for profiling wafer edges to prevent chipping during handling and processing in semiconductor fabrication. Turbine-powered industrial machine >5,000 kW under HTS 8411.82.80.10 statistical note 1.
Duty Rate — Mexico → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document edge profiling specifications (e.g
• chip angle, radius tolerance)
• Include handling capacity for 300mm wafers or larger
• Distinguish from general glass edge grinders in entry documentation