Industrial turbines of a kind described in statistical note 1 to this chapter
Turbojets, turbopropellers and other gas turbines, and parts thereof: > Other gas turbines: > Of a power exceeding 5,000 kW: > Other > Industrial turbines of a kind described in statistical note 1 to this chapter
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8411.82.80.10
Czochralski Crystal Puller for Silicon Wafers
A Czochralski method crystal grower and puller used to produce monocrystalline silicon boules from which semiconductor wafers are sliced. This equipment falls under HTS 8411.82.80.10 as an industrial turbine-powered system exceeding 5,000 kW, specifically matching statistical note 1 for semiconductor manufacturing crystal growers.
Float Zone Crystal Puller for Gallium Arsenide
Float zone crystal puller equipment for growing high-purity monocrystalline gallium arsenide boules used in semiconductor devices. Classified under HTS 8411.82.80.10 as an industrial gas turbine system >5,000 kW per statistical note 1 for semiconductor crystal growth.
Crystal Boule Grinder for Semiconductor Wafers
Precision crystal grinder that shapes semiconductor boules to exact diameters and grinds flats indicating conductivity type. This wafer preparation machine uses an industrial turbine >5,000 kW, fitting HTS 8411.82.80.10 per statistical note 1 for semiconductor processing.
Wafer Slicing Diamond Saw for Silicon Boules
High-precision diamond wafer slicing saw that cuts monocrystalline silicon boules into individual semiconductor wafers. Powered by industrial gas turbine exceeding 5,000 kW, classified in HTS 8411.82.80.10 under statistical note 1 for wafer manufacturing equipment.
Chemical Mechanical Wafer Polisher
CMP (Chemical Mechanical Polishing) tool for final surface finishing of semiconductor wafers, achieving atomic-level flatness. Industrial turbine-driven >5,000 kW system per HTS 8411.82.80.10 and statistical note 1 for wafer polishers.
Precision Wafer Edge Grinder
Specialized grinder for profiling wafer edges to prevent chipping during handling and processing in semiconductor fabrication. Turbine-powered industrial machine >5,000 kW under HTS 8411.82.80.10 statistical note 1.
Automated Wafer Lapping System
Fully automated lapping system that processes multiple semiconductor wafers simultaneously for thickness uniformity. High-power industrial turbine configuration qualifies under HTS 8411.82.80.10 per statistical note 1.
Double-Sided Wafer Grinder and Lapper
Double-sided grinding and lapping machine that processes both sides of semiconductor wafers simultaneously to achieve precise thickness and flatness tolerances. Features industrial turbine power >5,000 kW, qualifying under HTS 8411.82.80.10 statistical note 1.
High-Power Turbine Crystal Growth Furnace
Integrated crystal growth furnace system with gas turbine exceeding 5,000 kW for semiconductor boule production via Czochralski process. Directly matches HTS 8411.82.80.10 description for statistical note 1 equipment.