8411.82.80.10/Precision Wafer Edge Grinder/Japan

Precision Wafer Edge Grinder from Japan

Specialized grinder for profiling wafer edges to prevent chipping during handling and processing in semiconductor fabrication. Turbine-powered industrial machine >5,000 kW under HTS 8411.82.80.10 statistical note 1.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document edge profiling specifications (e.g

• chip angle, radius tolerance)

• Include handling capacity for 300mm wafers or larger

• Distinguish from general glass edge grinders in entry documentation