Precision Wafer Edge Grinder from China
Specialized grinder for profiling wafer edges to prevent chipping during handling and processing in semiconductor fabrication. Turbine-powered industrial machine >5,000 kW under HTS 8411.82.80.10 statistical note 1.
Duty Rate — China → United States
40%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document edge profiling specifications (e.g
• chip angle, radius tolerance)
• Include handling capacity for 300mm wafers or larger
• Distinguish from general glass edge grinders in entry documentation