Precision Wafer Edge Grinder from Canada
Specialized grinder for profiling wafer edges to prevent chipping during handling and processing in semiconductor fabrication. Turbine-powered industrial machine >5,000 kW under HTS 8411.82.80.10 statistical note 1.
Duty Rate — Canada → United States
12.5%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document edge profiling specifications (e.g
• chip angle, radius tolerance)
• Include handling capacity for 300mm wafers or larger
• Distinguish from general glass edge grinders in entry documentation