8411.82.80.10/Double-Sided Wafer Grinder and Lapper/Japan

Double-Sided Wafer Grinder and Lapper from Japan

Double-sided grinding and lapping machine that processes both sides of semiconductor wafers simultaneously to achieve precise thickness and flatness tolerances. Features industrial turbine power >5,000 kW, qualifying under HTS 8411.82.80.10 statistical note 1.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Document achievable flatness specifications (e.g

• <1 micron) to confirm semiconductor-grade precision

• Include cleanroom compatibility certifications for classification support