Double-Sided Wafer Grinder and Lapper from Japan
Double-sided grinding and lapping machine that processes both sides of semiconductor wafers simultaneously to achieve precise thickness and flatness tolerances. Features industrial turbine power >5,000 kW, qualifying under HTS 8411.82.80.10 statistical note 1.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document achievable flatness specifications (e.g
• <1 micron) to confirm semiconductor-grade precision
• Include cleanroom compatibility certifications for classification support