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8411.82.80.10/Double-Sided Wafer Grinder and Lapper/Germany

Double-Sided Wafer Grinder and Lapper from Germany

Double-sided grinding and lapping machine that processes both sides of semiconductor wafers simultaneously to achieve precise thickness and flatness tolerances. Features industrial turbine power >5,000 kW, qualifying under HTS 8411.82.80.10 statistical note 1.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Document achievable flatness specifications (e.g

• <1 micron) to confirm semiconductor-grade precision

• Include cleanroom compatibility certifications for classification support

Double-Sided Wafer Grinder and Lapper from Germany — Import Duty Rate | HTS 8411.82.80.10