8411.82.80.10/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP (Chemical Mechanical Polishing) tool for final surface finishing of semiconductor wafers, achieving atomic-level flatness. Industrial turbine-driven >5,000 kW system per HTS 8411.82.80.10 and statistical note 1 for wafer polishers.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Specify slurry chemistry compatibility and polishing pad materials in documentation

• Include removal rate specifications (nm/min) proving semiconductor application

• Request binding ruling for hybrid CMP/etch tools to prevent reclassification