Chemical Mechanical Wafer Polisher from China
CMP (Chemical Mechanical Polishing) tool for final surface finishing of semiconductor wafers, achieving atomic-level flatness. Industrial turbine-driven >5,000 kW system per HTS 8411.82.80.10 and statistical note 1 for wafer polishers.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify slurry chemistry compatibility and polishing pad materials in documentation
• Include removal rate specifications (nm/min) proving semiconductor application
• Request binding ruling for hybrid CMP/etch tools to prevent reclassification