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8411.82.80.10/Automated Wafer Lapping System/Japan

Automated Wafer Lapping System from Japan

Fully automated lapping system that processes multiple semiconductor wafers simultaneously for thickness uniformity. High-power industrial turbine configuration qualifies under HTS 8411.82.80.10 per statistical note 1.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify throughput (wafers/hour) and thickness tolerance achieved

• Include automation software validation for fab integration