Automated Wafer Lapping System from Germany
Fully automated lapping system that processes multiple semiconductor wafers simultaneously for thickness uniformity. High-power industrial turbine configuration qualifies under HTS 8411.82.80.10 per statistical note 1.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify throughput (wafers/hour) and thickness tolerance achieved
• Include automation software validation for fab integration