Wafer Slicing Saw Drive Turbine from Canada
Compact gas turbine powering high-precision wafer slicing saws that cut semiconductor wafers from monocrystalline boules. Specifically designed for semiconductor wafer preparation equipment as described in statistical note 1, power not exceeding 5,000 kW.
Duty Rate — Canada → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide saw blade specifications linking to semiconductor boule slicing; certify power consumption ≤5,000kW; avoid bulk packaging that might suggest parts classification