Industrial turbines of a kind described in statistical note 1 of this chapter
Turbojets, turbopropellers and other gas turbines, and parts thereof: > Other gas turbines: > Of a power not exceeding 5,000 kW: > Other > Industrial turbines of a kind described in statistical note 1 of this chapter
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8411.81.80.10
Czochralski Crystal Puller Turbine
A specialized gas turbine powering Czochralski crystal pullers used to grow monocrystalline silicon boules from which semiconductor wafers are sliced. Classified under HTS 8411.81.80.10 as an industrial turbine for semiconductor manufacturing equipment per statistical note 1. Power output does not exceed 5,000 kW, designed specifically for precise control in crystal growth processes.
Float Zone Crystal Growth Turbine
Industrial gas turbine integrated into float zone equipment for producing high-purity monocrystalline semiconductor boules using zone melting techniques. Meets HTS 8411.81.80.10 criteria for semiconductor processing turbines under statistical note 1, with power ≤5,000 kW.
Wafer Slicing Saw Drive Turbine
Compact gas turbine powering high-precision wafer slicing saws that cut semiconductor wafers from monocrystalline boules. Specifically designed for semiconductor wafer preparation equipment as described in statistical note 1, power not exceeding 5,000 kW.
Crystal Grinder Turbine for Semiconductor Boules
Gas turbine driving crystal grinders that shape semiconductor boules to precise diameters and flats indicating conductivity type. HTS 8411.81.80.10 applies to this industrial turbine for wafer preparation equipment per statistical note 1.
Wafer Lapping Polisher Drive Turbine
Precision gas turbine powering wafer lappers and polishers that achieve critical flatness for semiconductor fabrication processes. Classified under 8411.81.80.10 as semiconductor wafer preparation turbine per statistical note 1, ≤5,000 kW.
Silicon Ingot Processing Turbine
Industrial turbine for silicon ingot processing equipment used in semiconductor boule grinding and preparation stages. Qualifies under HTS 8411.81.80.10 statistical note 1 for semiconductor manufacturing apparatus with power ≤5,000 kW.