Wafer Lapping Polisher Drive Turbine from Japan
Precision gas turbine powering wafer lappers and polishers that achieve critical flatness for semiconductor fabrication processes. Classified under 8411.81.80.10 as semiconductor wafer preparation turbine per statistical note 1, ≤5,000 kW.
Duty Rate — Japan → United States
27.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify surface flatness tolerances in technical docs; verify dedicated semiconductor wafer use; prepare for CBP questions on statistical note applicability