Wafer Lapping Polisher Drive Turbine from Germany
Precision gas turbine powering wafer lappers and polishers that achieve critical flatness for semiconductor fabrication processes. Classified under 8411.81.80.10 as semiconductor wafer preparation turbine per statistical note 1, ≤5,000 kW.
Duty Rate — Germany → United States
27.5%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify surface flatness tolerances in technical docs; verify dedicated semiconductor wafer use; prepare for CBP questions on statistical note applicability