Wafer Slicing Saw Stationary Guide Blade from Japan
Stationary guide blade for inner diameter wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, ensuring precise kerf and flatness. Falls under HTS 8406.90.70.00 as a stationary blade component of vapor turbine-driven saws in wafer preparation equipment per statistical note (a)(ii)(B). Critical for minimizing wafer defects in semiconductor fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit slicing tolerance data (<1 micron) and boule diameter compatibility (up to 450mm) to validate wafer prep classification
• Pair with statistical note certification; require supplier affidavits confirming semiconductor-only use