8406.90.70.00/Wafer Slicing Saw Stationary Guide Blade/Japan

Wafer Slicing Saw Stationary Guide Blade from Japan

Stationary guide blade for inner diameter wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, ensuring precise kerf and flatness. Falls under HTS 8406.90.70.00 as a stationary blade component of vapor turbine-driven saws in wafer preparation equipment per statistical note (a)(ii)(B). Critical for minimizing wafer defects in semiconductor fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit slicing tolerance data (<1 micron) and boule diameter compatibility (up to 450mm) to validate wafer prep classification

• Pair with statistical note certification; require supplier affidavits confirming semiconductor-only use