Blades, rotating or stationary
Steam turbines and other vapor turbines, and parts thereof: > Parts: > Other: > Blades, rotating or stationary
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8406.90.70.00
Czochralski Crystal Puller Rotating Blade
A high-precision rotating blade used in Czochralski method crystal growers to facilitate the pulling and rotation of monocrystalline silicon boules during semiconductor wafer production. It falls under HTS 8406.90.70.00 as a rotating blade specifically designed as a part for crystal pullers classified as vapor turbines in semiconductor manufacturing equipment. The blade ensures uniform crystal growth by maintaining precise rotational speeds under high-temperature conditions.
Float Zone Crystal Grower Stationary Blade
Stationary guide blade employed in float zone crystal growers to stabilize the molten zone during the production of high-purity silicon boules for semiconductor wafers. Classified under HTS 8406.90.70.00 as a stationary blade part of vapor turbines used in semiconductor material growth per statistical note (a)(i). It maintains positional accuracy under extreme thermal gradients.
Wafer Slicing Saw Stationary Guide Blade
Stationary guide blade for inner diameter wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, ensuring precise kerf and flatness. Falls under HTS 8406.90.70.00 as a stationary blade component of vapor turbine-driven saws in wafer preparation equipment per statistical note (a)(ii)(B). Critical for minimizing wafer defects in semiconductor fabrication.
Crystal Boule Grinder Rotating Blade
Rotating diamond-impregnated blade for grinding semiconductor crystal boules to exact diameters and flats indicating conductivity type, as in statistical note (a)(ii)(A). Classified under HTS 8406.90.70.00 as rotating blade of vapor turbine grinders in wafer preparation equipment. Ensures wafers meet strict semiconductor industry standards for resistivity uniformity.
Wafer Lapping Machine Stationary Blade
Stationary conditioning blade in wafer lapping equipment that maintains surface flatness within nanometer tolerances for semiconductor device fabrication readiness, per statistical note (a)(ii)(C). Under HTS 8406.90.70.00 as stationary turbine blade part for wafer preparation polishers. Essential for achieving total thickness variation (TTV) specs in silicon wafers.
Semiconductor Turbine Rotor Blade Set
Matched set of rotating blades for the rotor assembly in vapor turbines powering crystal growers and wafer processing equipment listed in statistical note (a). HTS 8406.90.70.00 covers these stationary/rotating blades as essential parts ensuring balanced high-RPM operation. Precision-balanced for 24/7 semiconductor production environments.
High-Temperature Turbine Stator Blades
Stationary stator blades made from nickel superalloys for directing vapor flow in turbines driving semiconductor boule pullers, enduring >1600°C per statistical note (a)(i). Classified HTS 8406.90.70.00 as stationary blades critical for efficient energy transfer in crystal growth. Coatings prevent material contamination of semiconductor crystals.