Wafer Slicing Saw Stationary Guide Blade from Canada
Stationary guide blade for inner diameter wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, ensuring precise kerf and flatness. Falls under HTS 8406.90.70.00 as a stationary blade component of vapor turbine-driven saws in wafer preparation equipment per statistical note (a)(ii)(B). Critical for minimizing wafer defects in semiconductor fabrication.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Submit slicing tolerance data (<1 micron) and boule diameter compatibility (up to 450mm) to validate wafer prep classification
• Pair with statistical note certification; require supplier affidavits confirming semiconductor-only use