Wafer Lapping Machine Stationary Blade from Germany
Stationary conditioning blade in wafer lapping equipment that maintains surface flatness within nanometer tolerances for semiconductor device fabrication readiness, per statistical note (a)(ii)(C). Under HTS 8406.90.70.00 as stationary turbine blade part for wafer preparation polishers. Essential for achieving total thickness variation (TTV) specs in silicon wafers.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include TTV performance data (<0.5μm) and lapping speed ratings to confirm wafer prep function
• Require end-user letters from wafer fabs (e.g
• TSMC, Intel) specifying turbine blade usage