Wafer Lapping Machine Stationary Blade from China
Stationary conditioning blade in wafer lapping equipment that maintains surface flatness within nanometer tolerances for semiconductor device fabrication readiness, per statistical note (a)(ii)(C). Under HTS 8406.90.70.00 as stationary turbine blade part for wafer preparation polishers. Essential for achieving total thickness variation (TTV) specs in silicon wafers.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Include TTV performance data (<0.5μm) and lapping speed ratings to confirm wafer prep function
• Require end-user letters from wafer fabs (e.g
• TSMC, Intel) specifying turbine blade usage