8406.90.70.00/Wafer Lapping Machine Stationary Blade/China

Wafer Lapping Machine Stationary Blade from China

Stationary conditioning blade in wafer lapping equipment that maintains surface flatness within nanometer tolerances for semiconductor device fabrication readiness, per statistical note (a)(ii)(C). Under HTS 8406.90.70.00 as stationary turbine blade part for wafer preparation polishers. Essential for achieving total thickness variation (TTV) specs in silicon wafers.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)

9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

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Import Tips

• Include TTV performance data (<0.5μm) and lapping speed ratings to confirm wafer prep function

• Require end-user letters from wafer fabs (e.g

• TSMC, Intel) specifying turbine blade usage