Crystal Boule Grinder Rotating Blade from Japan
Rotating diamond-impregnated blade for grinding semiconductor crystal boules to exact diameters and flats indicating conductivity type, as in statistical note (a)(ii)(A). Classified under HTS 8406.90.70.00 as rotating blade of vapor turbine grinders in wafer preparation equipment. Ensures wafers meet strict semiconductor industry standards for resistivity uniformity.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flat grinding specs for conductivity marking (e.g
• <0.5° tolerance) to tie to statistical note requirements
• Use customs ruling requests for blades >300mm boule capacity to preempt challenges